Abrasive Materials
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Silicon Carbide Powder for Wiresaw Usage
Product Category : Abrasive Materials

Specifications:

JIS&FEPA F series.

Special requirement can be satisfied through negotiation.

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Application:

The micropowder is the abrasive materials for solar industry,semiconductor industry and piezoelectric industry,widely used for the cutting of 3~12inch mono-crystalline silicon,poly-crystal silicon,potassium arsenide and quartz crystal with the wiresaw.

 

Features:

1.The large crystal of this highly pure silicon carbide ensures the excellent cutting capability.

2.The blocky shape of the grain ensures minimum TTV.

3.Particle size distribution is narrow.

4.Its stability anti-high-heat-shock and temperature-softening characteristic under heavy duty guarantee the small linear expansion in processing,suitable to all kinds of wiresaw machines.

5.Treated specially,the grain have good affinity with carrier liquid,such as glycol,etc.

 


Size

Particle size distribution(by)Beckman Coulter)

D100≥

D94≥

D50

≤D3

D0≤

S.D.≤

JIS800

3.20

9.00

14±1.80

23

38

2.8

JIS1000

3.20

7.00

11.5±0.80

19

32

2.8

JIS1200

2.20

5.50

9.5±0.80

17

27

2.8

JIS1500

2.20

4.50

8.0±0.60

15

23

3.0

JIS2000

1.52

4.00

6.7±0.60

13

19

3.0


Size

Bulk
Density≤
(g/cm3)

 

Magnetic
Materials
≤(%)

PH value

SiC≥

F.C.≤

Fe2O3≤

JIS800

1.03

99.00

0.15

0.15

0.08

6.0-7.5

JIS1000

0.96

98.50

0.15

0.15

0.08

6.0-7.5

JIS1200

0.93

98.50

0.18

0.18

0.08

6.0-7.5

JIS1500

0.84

98.00

0.18

0.18

0.08

6.0-7.5

JIS2000

0.82

98.00

0.20

0.20

0.08

6.0-7.5

 

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